Tag: Solder Mask

Finished Board SpecificationsLayer Count (FR-4)1 – 20 layersHDI1–3阶 (mechanical blind or laser blind vias)Board Thickness0.6 – 3.2 mm (thickness varies with layer count)Thickness Tolerance (≥ 1.0 mm)±10%Thickness Tolerance (< 1.0 mm)±0.10 mmMax Board

Universe solder mask blasting pretreatment GL231108B1025A (1 unit). Surface preparation before solder mask for optimal coating adhesion and zero bubbles.

LPI solder mask application, exposure, curing. Silkscreen legend for component identification. Pre-treatment of aerospace assembly for sandblasting ensures perfect adhesion.

Final AOI scan verifies solder mask coverage, pad alignment & legend quality after all processing. Last automated gate before electrical test.

Taiyo & Tamura LPI solder mask. Apply, expose, develop, cure. Green standard; black, white, blue, red available. Precision dam formation between fine-pitch pads.

IPC-A-600 defines visual acceptance criteria for bare printed circuit boards — the standard our incoming QC team uses to inspect every PCB before assembly. Covers lamination, plating, solder mask, and dimensional defects.

8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber

Rigid-flex PCB manufacturing — 14 layers · 10 rigid + 4 flex · 2+2 split · 2.2 mm · Panasonic · 3 mil line · Lead-free HASL · Build-to-print from Gerber files